File:Wirebonding2.svg

Size of this PNG preview of this SVG file: 600 × 300 pixels. Other resolutions: 320 × 160 pixels | 640 × 320 pixels | 1,024 × 512 pixels | 1,280 × 640 pixels | 2,560 × 1,280 pixels.

Original file (SVG file, nominally 600 × 300 pixels, file size: 21 KB)

This is a file from the Wikimedia Commons. Information from its description page there is shown below.
Commons is a freely licensed media file repository. You can help.

Description

English: A sketch diagram of the wedge-bond wirebonding in a power transistor in a package such as a D2PAK. The copper tab forms the drain connection, as is exposed in the finished product. This whole assembly is held in a rigid, insulating material. The aluminium wires are generally around 250 to 400 µm thick.

Date

19 November 2008

Source

Own work

Author

Inductiveload

Permission
(Reusing this file)

I, the copyright holder of this work, hereby publish it under the following licenses:

Permission is granted to copy, distribute and/or modify this document under the terms of the GNU Free Documentation License, Version 1.2 or any later version published by the Free Software Foundation; with no Invariant Sections, no Front-Cover Texts, and no Back-Cover Texts. A copy of the license is included in the section entitled GNU Free Documentation License.

	This file is licensed under the Creative Commons Attribution-Share Alike 3.0 Unported license.

	You are free: to share – to copy, distribute and transmit the work to remix – to adapt the work Under the following conditions: attribution – You must give appropriate credit, provide a link to the license, and indicate if changes were made. You may do so in any reasonable manner, but not in any way that suggests the licensor endorses you or your use. share alike – If you remix, transform, or build upon the material, you must distribute your contributions under the same or compatible license as the original.
	This licensing tag was added to this file as part of the GFDL licensing update.CC BY-SA 3.0truetrue

This file is licensed under the Creative Commons Attribution-Share Alike 2.5 Generic, 2.0 Generic and 1.0 Generic license.

You are free:

to share – to copy, distribute and transmit the work
to remix – to adapt the work

Under the following conditions:

attribution – You must give appropriate credit, provide a link to the license, and indicate if changes were made. You may do so in any reasonable manner, but not in any way that suggests the licensor endorses you or your use.
share alike – If you remix, transform, or build upon the material, you must distribute your contributions under the same or compatible license as the original.

You may select the license of your choice.

Other versions

Derivative works of this file: Wirebonding2 DE.svg

Based on Wirebonding.svg by Cyril Buttay.

File history

Click on a date/time to view the file as it appeared at that time.

	Date/Time	Dimensions	User	Comment
current	07:08, 19 November 2008	600 × 300 (21 KB)	Inductiveload	Something odd is going on here. Sorry for any duplicate uploads.
	07:07, 19 November 2008	600 × 300 (23 KB)	Inductiveload	Fix minor rendering error
	07:07, 19 November 2008	600 × 300 (23 KB)	Inductiveload	Fix minor rendering error
	07:04, 19 November 2008	600 × 300 (21 KB)	Inductiveload	{{Information \|Description= \|Source= \|Date= \|Author= \|Permission= \|other_versions= }}
	06:54, 19 November 2008	600 × 300 (23 KB)	Inductiveload	{{Information \|Description={{en\|1=A sketch diagram of the wirebonding in a power transistor in a package such as a D2PAK. The copper tab forms the drain connection, as is exposed in the finished product. This whole assembly is held in a rigid, insulating